Preparation and Characterization of Flexible Phase Change Material for Compact Electrical Applications

Authors

  • Vivek Sharma School of Mechanical Engineering, Shiri Mata Vasihno Devi University, Jammu 182320, India
  • Ankit Singh School of Mechanical Engineering, Shiri Mata Vasihno Devi University, Jammu 182320, India
  • Abhir Bhatia School of Mechanical Engineering, Shiri Mata Vasihno Devi University, Jammu 182320, India
  • Shivanshu Maurya School of Mechanical Engineering, Shiri Mata Vasihno Devi University, Jammu 182320, India
  • Mohit Kumar School of Mechanical Engineering, Shiri Mata Vasihno Devi University, Jammu 182320, India
  • Eswaramoorthy Muthusamy School of Mechanical Engineering, Shiri Mata Vasihno Devi University, Jammu 182320, India

DOI:

https://doi.org/10.48048/tis.2023.6073

Keywords:

Flexible phase change materials, Compactness, Miniaturization, Heat transfer, Thermal management

Abstract

The development of advances in digital technologies, the compact electronic devices plays an important role but the space constraints and irregular surfaces in the device makes it hard to dissipate heat with the help of external medium. They overheat in most of the cases and become a common cause for failure of the device. Phase Change Materials (PCM) release or absorb heat at its melting temperature to its better thermal management. But the PCM have limitations as its brittleness could not occupy the irregular surfaces of compact electronic devices and undergo deformations during operation, a new class of material Flexible PCM (FPCM) developed to endure a certain amount of deformation and make compact contact with irregular surfaces of objects, making them ideal for many smart applications. In this work, the newer thin film FPCM are prepared using Olefin Block Copolymer and paraffin wax at different combinations on mass basis and field emission SEM and XRD characterization of samples are studied and reported. This paper presents selection of optimal PCM and copolymer, preparation of FPCM and detailed analysis of the sample report and electrical device applications. This report provides a basis for implementing and optimizing phase change thermal management techniques in electrical devices. The experimental results shows PCM 45 and 55 wt% co-polymer combination of FPCM having better thermal management in Electrical Applications. Thermal analysis will be studied in future.

HIGHLIGHTS

  • Flexible Phase Change Materials (FPCM) prepared and properties are studied
  • Olefin Block Copolymer and paraffin wax at different combinations on mass basis developed and studied
  • FPCM used for Compact Electronic Applications considered as LED Lamb


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Published

2023-06-02

How to Cite

Sharma, V. ., Singh, A. ., Bhatia, A. ., Maurya, S. ., Kumar, M. ., & Muthusamy, E. . (2023). Preparation and Characterization of Flexible Phase Change Material for Compact Electrical Applications. Trends in Sciences, 20(10), 6073. https://doi.org/10.48048/tis.2023.6073

Issue

Vol. 20 No. 10 (2023): Trends in Sciences, Volume 20, Number 10, October 2023

Section

Research Articles

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